Lead (Pb)-free solders for electronic packaging
用于电子封装的无铅 （Pb） 焊料

Abstract  抽象

The harmful effects of lead on the environment and human health, coupled with the threat of legislation, have prompted a serious search for lead-free solders for electronic packaging applications. At present, Sn-Pb eutectic and other Pb-containing solders find widespread use in printed circuit board assembly. Several Pb-free solder alloys which appear to have the potential for replacing Sn-Pb solders are receiving increased attention from the electronic assembly community. Recently, numerous studies have been published detailing the wetting characteristics, tensile and shear strength, and creep and low-cycle fatigue properties of these alloys. It is the purpose of this paper to review these results and assess the suitability of the solders for electronic packaging from the viewpoints of process technology and reliability.
铅对环境和人类健康的有害影响，加上立法的威胁，促使人们认真寻找用于电子封装应用的无铅焊料。目前，Sn-Pb 共晶和其他含铅焊料在印刷电路板组装中得到广泛应用。几种似乎有可能取代 Sn-Pb 焊料的无铅焊料合金越来越受到电子组装界的关注。最近，发表了大量研究，详细介绍了这些合金的润湿特性、拉伸和剪切强度以及蠕变和低周疲劳性能。本文旨在从工艺技术和可靠性的角度对这些结果进行综述，并评估焊料在电子封装中的适用性。